仕事概要
| 職種 | 技術職（販売、設計、開発、生産管理）／生産管理、品質管理、施工管理、EHS、PMS |
|---|---|
| 業種 | 電気、電子、機械／ 半導体、エレクトロニクス、電子部品 |
| 雇用形態 | 未分類 |
| ポジションレベル | 本部長/経営層レベル |
| 募集人数 | 1名 |
| 希望入社時期 | - |
| 必須語学力 | |
| 活かせる語学 | - |
| 福利厚生・休暇 |
仕事詳細
- Well established MNC in the semiconductor equipment space
- High visibility portfolio supporting advanced semiconductor packaging equipment
- Our client is a well-established MNC in the semiconductor equipment industry.
The Senior Engineer Field Applications for Thermo Compression Bonders is instrumental in product penetration / adoption and process optimization at customer sites as well as the factory. He / she will support pre-sales and post-sales activities, managing customer demonstrations and assisting in identifying key sales opportunities with related parties. Developing and implementing product applications is also part of the portfolio.
Ideally, the candidate should come with University Degree in Engineering / Physics / Material Science and at least 5 years of relevant applications support experience in a hi-tech semiconductor equipment, or advanced semiconductor packaging development environment. He / she should possess knowledge in backend processes like Flip Chip, Cu Pillar, Die Attach, Thermo compression, TSV etc. Front end semiconductor processes is a plus. Travelling is expected in Asia Pacific region.
面接について
連絡先
Senior Field Applications Engineer, Advanced Semiconductor Packaging
RGFタレントソリューションズ株式会社
72000 〜 91000 SGD
