Senior Field Applications Engineer, Advanced Semiconductor Packaging

- Well established MNC in the semiconductor equipment space 
- High visibility portfolio supporting advanced semiconductor packaging equipment
- Our client is a well-established MNC in the semiconductor equipment industry.
The Senior Engineer Field Applications for Thermo Compression Bonders is instrumental in product penetration / adoption and process optimization at customer sites as well as the factory. He / she will support pre-sales and post-sales activities, managing customer demonstrations and assisting in identifying key sales opportunities with related parties. Developing and implementing product applications is also part of the portfolio.
Ideally, the candidate should come with University Degree in Engineering / Physics / Material Science and at least 5 years of relevant applications support experience in a hi-tech semiconductor equipment, or advanced semiconductor packaging development environment. He / she should possess knowledge in backend processes like Flip Chip, Cu Pillar, Die Attach, Thermo compression, TSV etc. Front end semiconductor processes is a plus. Travelling is expected in Asia Pacific region.

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